Step into a career with ASM, where cutting edge technology meets collaborative culture.
For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.
Job's mission
As a Senior Engineer I, Process Engineering (PECVD) at ASM Korea, you will play a key role in developing, optimizing, and supporting advanced PECVD processes for leading semiconductor customers.
This role is based in Korea, with primary responsibility for supporting Japan-based customers and projects, requiring strong execution capability, deep process understanding, and excellent communication skills in a global environment. You will work closely with customers, field, and global R&D teams to enable high‑volume manufacturing and next‑generation device applications.
What you will be working on
- Develop, optimize, and support PECVD processes for dielectric and functional thin films (including SiO, SiC) for logic, memory, analog, power, and MEMS applications.
- Design, execute, and analyze complex experiments using DOE and RSM, and interpret advanced process and materials characterization results.
- Drive process transfer, customer demonstrations, and high‑volume manufacturing (HVM) support.
- Troubleshoot process and equipment issues through hands‑on engagement and structured problem‑solving methodologies.
- Collaborate with global R&D, field service, and marketing teams to define customer requirements and deliver robust process solutions.
- Produce and present technical documentation, internal reports, and customer-facing materials, ensuring clarity and execution readiness.
What we are looking for
- Master’s degree or PhD in Chemical Engineering, Materials Science, Electrical Engineering, Physics, or related field.
- Hands‑on experience with PECVD or related thin film deposition technologies (e.g., ALD, PEALD, CVD, Epitaxy).
- Strong understanding of thin film materials and semiconductor process integration.
- Experience with materials characterization techniques such as XPS, SIMS, SEM, TEM, AFM, XRD, ellipsometry, or equivalent.
- Ability to work independently in complex, execution‑driven environments and manage multiple technical priorities.
- Fluent English communication skills required for daily collaboration with global and Japan-based stakeholders.
- Willingness to travel to Japan as required to support projects.
What sets you apart
- PhD degree preferred, especially with research or industry experience in PECVD process development.
- Direct experience with SiO and/or SiC film development for advanced device applications.
- Strong background in high‑volume manufacturing (HVM) support and customer‑facing process execution.
- Ability to bridge process technology, equipment behavior, and customer requirements effectively.
- Demonstrated ability to author technical papers, contribute to intellectual property, or present to technical audiences.
Apply today to be part of what’s next.
We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.
To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.
ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.